Chinese telecoms giant Huawei pushes semiconductor packaging innovation to ease disruptions caused by US chip sanctions

//Chinese telecoms giant Huawei pushes semiconductor packaging innovation to ease disruptions caused by US chip sanctions

Chinese telecoms giant Huawei pushes semiconductor packaging innovation to ease disruptions caused by US chip sanctions

The struggling Chinese telecoms giant has filed a patent application on the mainland for a semiconductor packaging innovation that could help lower the cost of chip manufacturing.

Article by [author-name] (c) Big Tech - South China Morning Post - Read full story here.

By | 2022-04-07T12:30:26+00:00 April 7th, 2022|Technology|Comments Off on Chinese telecoms giant Huawei pushes semiconductor packaging innovation to ease disruptions caused by US chip sanctions